Below is a list of minimum and maximum values for PCB specifications and materials and build information. Consider using average or greater than minimum values for designs which do not require tight designs rules, in order for effective DFM.
This Table uses both Metric and Imperial measurement.
| Specification | Option |
|---|---|
| PCB Type | PCB; FPC; R-F PCB; HDI |
| Layer count | 2 – 16 Layers |
| Finished board thickness | 0.2 – 8.0mm |
| Soldermask color | Green ; Black or Matte Black; Blue; Red; White; Yellow; Transparency |
| Legend color | White; Yellow; Black |
| FR4 | KB-6160; S1141 |
| Tg FR4 (halogen-free) | S1155 |
| High Tg FR4 (halogen-free) | S1165 |
| Hight CTI | S1600 |
| High Tg FR4 | S1000-2; IT180A; KB-6165; KB6167 |
| Ceramic laminates high frequency | Rogers4350; Rogers4003; 25FR; 25N |
| PTFE high frequency | Rogers; Taconic; Arlon |
| Lead free HASL | 2~30μm |
| ENIG | Ni: 3-8μm; Au: 0.025~0.1μm |
| Immersion Tin | ≥1.0μm |
| Immersion silver | 0.2~0.4μm |
| OSP | 0.1~0.3μm |
| Plating hard gold | 5~60uinch |
| Plating soft gold | 5~60uinch |
| Hard gold | 5~20uinch |
| Carbon ink | 0.10~0.35mm |
| Soldermask | 10~25μm |
| Peelable mask | 0.20~0.50mm |
| Mechanical drilling | 0.2~6.2mm |
| Max aspect ratio | 16:1 |
| PTH tolerance | +- 3mil |
| Pressfilt hole tolerance | +- 2mil |
| NPTH tolerance | +- 2mil |
| Resin-filled via size | 0.2-0.8mm |
| Angle of counter-sink/bore | 82° ; 90°; 100°; 130°; 135°; 165° |
| Counter-sink angle tolerance | +-10° |
| Counter-sink/bore dia.tolerance | +-0.20mm |
| Counter-sink/bore depth tolerance | +-0.15mm |
| Inner layer | 12μm (0.3ounce) |
| 18μm (0.5ounce) | |
| 35μm (1ounce) | |
| 70μm (2ounce) | |
| 105μm (3ounce) | |
| 140μm (4ounce) | |
| 175μm (5ounce) | |
| Outer layer | 12μm (0.33ounce) |
| 18μm (0.5ounce) | |
| 35μm (1ounce) | |
| 70μm (2ounce) | |
| 105μm (3ounce) | |
| 140μm (4ounce) | |
| Track width tolerance | ≤10mil: +-1.0mil; ≥10mil: +-1.5mil |
| Min track width/space | 3/3mil |
| Min gap between hole to copper (HDI) | 6-8mil HDI (1~3 steps) |
| Min gap between hole to copper | 5.5mil (≤8L) ; 6.5mil (10-14L) ; 7mil (≥14L) |
| ENIG min gap | 3mil |
| Gold finger min gap | 7mil |
| HASL min gap | 7mil |
| Min gap between peelable mask to pad | 14mil |
| Min gap between legend to pad | 6mil (print) ; 4mil (image print) |
| Min gap for carbon | 13mil |
| HDI Lamination | Max laminating 4 times |
| Min BGA diameter | 7mil |
| Min BGA pitch | 0.4mm |
| Min PCB size | 12mm x 12mm (smaller on request) |
| Max. PCB size | 580mm x 1010mm *On request |
| Finished board thickness | T≤1.0mm; +-0.1mm |
| T>1.0mm; +-10% | |
| Impedance control tolerance | +-5Ω (≤50Ω) ; +-10% (≥50Ω) ; +-5% (≥50Ω) |
| Outline tolerance | +-0.1mm |
| Max finished copper thickness | Inner layer: 4oz; outer layer: 5oz |
| Min legend size | width: 4mil; height: 23mil |
| Min radius of inner angle | 0.3mm |
| V-CUT angle tolerance | +-5° |
| Min soldermask bridge width | 3.5mil |
| Gold finger chamfer tolerance | +-5° |